EPO-TEK H70E Thermally Conductive Epoxy环氧树脂胶粘剂 16017 2.EPO-TEK H70E Thermally Conductive Epoxy环氧树脂粘合剂 16017-现货 3.EPO-TEK H70E Thermally Conductive Epoxy环氧树脂胶(万能胶)16017-现货 4.EPO-TEK H70E Thermally Conductive Epoxy导热绝缘环氧树脂胶粘剂 16017-桑戈生物 5.EPO-TEK H70E Thermally Conductive Epoxy环氧胶粘剂(大力胶)16017-桑戈生物 货号:16017 包装:85g/盒 价格:电议 该产品有现货,期货平均到货时间2周,另有特快加急服务(7天到货) 产品描述: EPO-TEK® H70E是一种双组份、导热绝缘的环氧树脂,设计来满足微电子和光电子芯片的粘接应用。它是非常优秀的散热粘合剂,尤其推荐使用在需要良好散热的应用上。它具有优异的操作性能,在室温下拥有极长的粘附寿命。使用非常简便;可以丝网印制,机器分配和印花或者手工实施。拥有优秀的粘附力,可以粘附于铁或者非铁类金属、玻璃、陶瓷、可伐合金以及印刷电路板。凝固非常迅速。 EPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. It is an excellent heat-sinking adhesive and is recommended for thermal management applications where good heat dissipation is needed. EPO-TEK® H70E exhibits excellent handling characteristics and an extremely long pot life at room temperature. Easy to use; can be screen printed, machine dispensed, stamped or hand applied. Excellent adhesion to ferrous and non-ferrous metals, glass, ceramic, kovar and PCB. Can be cured very rapidly. Cure Schedule (minimum bond temperature/time) Properties (summary) · Color : Grey / Beige · Consistency: Slightly Pourable Paste · Viscosity: 4,000 – 7,000 cps · Thermal Conductivity: 0.9 W/mK · Operating Temperature: -55ºC to 200ºC (-67ºF to 392ºF) · Pot Life
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